About Us
As a leading electronic component provider Xtratek specialises in marketing sophiscated sockets designed to meet the rigorous demands of an evolving semiconductor landscape. We proudly represent world-class manufacturers, offering both standard and custom-engineered products tailored to your specific requirements.
Our team has extensive experience serving key players in the industries such as Aerospace & Defence, Health Care, Semiconductor and Telecommunications. Some of our notable partners include Bharat Electronics Limited, ISRO, C-Dot and Tessolve Semiconductors.
Varghese T. Jacob, Xtratek president brings over three decades of experience in marketing and sales of advanced sockets. He developed an extensive knowledge of high-end precision sockets and their end-user markets during his tenure with 3M Textool, a leading Fortune 500 company. With a background in engineering and a Master of Business Administration from premier insitutions, he could position Xtratek as a premier consulting and business hub within the industry.
At Xtratek, we are committed to delivering cutting-edge components with a focus on quality, competitive pricing and swift turnaround times. Our mission is to provide the advanced technical support and innovative solutions necessary to ensure the seamless functioning of your ecosystem.
Application Notes
- Screening of devices as per MIL-STD 1553 BUS communication protocol for onboard equipment.
- Testing of satellites under orbit conditions.
- DC-DC converters, essential electronic circuits for power management.
Hybrid Microcircuits (HMC) are custom-made, high-reliability circuit modules frequently used in defense, aerospace, and critical applications, requiring rigorous screening to ensure performance under harsh conditions. These tests, often aligned with military standards, verify the integrity of the substrate, components, and package.
Common HMC Screening Tests
Screening is performed on all units to eliminate early failures before qualification or final integration.
- External Visual Inspection: Examination of the package for damage, contamination, or improper soldering.
- Internal Visual Inspection: Pre-encapsulation inspection of wire bonds, component placement, and substrate integrity.
- Hermeticity Test (Leak Test): Crucial for verifying that the sealed package protects components from moisture, dust, and environmental stress.
- Thermal Cycle Test: Subjecting the HMC to, for example, 10-20 cycles between and to check for structural integrity and thermal fatigue.
- Burn-in Test: Electrical operation at high temperatures for an extended period (e.g., 160 hours at 125°C) to stabilize parameters and identify infant mortality defects.
- Electrical Parameter Testing: Comprehensive testing for continuity, resistance, capacitance, and functional performance.
- Residual Gas Analysis (RGA): Used to detect internal moisture and harmful gases (e.g., ammonia) within the package.
Specific Reliability Enhancements
- Laser Trimming: Resistors are trimmed to precise values via laser to meet stringent design requirements.
- Component Verification System (CVS): Automatic inspection for component placement (e.g., beam lead devices, ribbon crossovers) to detect missing parts.
- ESD/EMI/EMC Testing: Specialized tests for DC-DC converters to ensure electromagnetic compatibility and electrostatic discharge immunity.
